5-533495-3 datasheet

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О ДАТАШИТЕ

Маркировка

5-533495-3
Производитель

TE Connectivity
Описание

TE Connectivity 5-533495-3 Body Orientation: Straight Center Guide: Without Centerline (mm [in]): 2.54 [0.100] Contact Base Material: Beryllium Copper Contact Configuration: Four-Beam Contact Material: Beryllium Copper Contact Plating: Gold Over Nickel Contact Plating, Mating Area, Material: Gold (30) Current Rating (max): 3/ContactA Gender: RCP Government/industry Qualification: No Housing Color: Brown Housing Material: Polyphenylene Sulfid Housing Material Temperature: High Lead Free Solder Processes: Wave solder capable to 240?°C, Wave solder capable to 260?°C, Wave solder capable to 265?°C, Reflow solder capable to 245?°C, Reflow solder capable to 260?°C, Pin-in-Paste capable to 245?°C, Pin-in-Paste capable to 260?°C Make First / Break Last: No Mating Alignment: Without Mounting Style: Through Hole Number Of Contact Rows: 3 Number Of Contacts: 174POS Number Of Positions: 174 Number Of Rows: 3 Operating Temp Range: -65C to 105C Pcb Mount Retention: Without Pcb Mount Style: Through Hole Pcb Mounting Orientation: Vertical Pitch (mm): 2.54mm Product Type: Connector Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Solder Tail Contact Plating: Tin Termination Method: Solder Termination Post Length (mm [in]): 4.57 [0.180] Type: HDI Underplate Material: Nickel Voltage Rating Max: 250VAC
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